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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Projects of DKE/UK 631.4

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IEC 47D/252/NP	1998-11-13	Proposal of the Japanese NC: BGA (Ball Grid Array) package measuring method More	Comment
IEC 47D/229/NP	1998-07-17	Proposal of the USNC: Common package unit design guide for BGA packages More	Comment
IEC 47D/214/NP	1998-02-06	Proposal of the Japanese NC: The individual standard for 0,8 mm pitch plastic fine pitch ball grid array (P-FBGA) family (Intended for inclusion into IEC 191-2) More	Comment
IEC 47D/210/NP	1998-02-06	Proposal of the Japanese NC: The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2) More	Comment
IEC 47D/314/CD	1998-02-06	Tape Ball Grid Array package, 0.6 mm ball diameter family (Intended for inclusion in 60191-2) More	Comment
IEC 47D/211/NP	1998-02-06	Proposal of the Japanese NC: The individual standard for 32&48 pins plastic fine pitch ball grid array (P-FBGA), 0,8 mm terminal pitch (Intended for inclusion into IEC 191-2) More	Comment
IEC 47D/213/NP	1998-02-06	Proposal of the Japanese NC: The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2) More	Comment
IEC 47D/163A/CDV	1997-09-12	Proposed modification of wire ended diode (intended for inclusion into IEC 60191-2) More	Comment
IEC 47D/170/CDV	1997-04-04	IEC 191-6: General rules for TSOP (Thin Small Outline Package) Type II More	Comment
IEC 47D/112/CD	1996-04-19	Proposal for a heat sink small outline (HSOP) family, similar to SOP family 075E contained in IEC 191-2 More	Comment

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