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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Projects of DKE/UK 631.4

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IEC 47D/589/FDIS	2002-04-12	IEC 60191-2, F56, Ed.1: (will become IEC 60191-2/A11/Ed.1): Proposed new package outline, 5-leaded Power SMD (Outline 176E-a) More	Comment
IEC 47D/503/NP	2002-04-12	Proposed new package outline, 3/4-land SMD (If approved, to be included in IEC 60191-2) More	Comment
IEC 47D/435/FDIS	2001-05-11	IEC 60191-2, F41, Ed.1: Proposal for a supplement of QFN outline drawings to the outline family of 102E More	Comment
IEC 47D/533/CD	2001-02-23	IEC 60191-6-9, Ed.2: Mechanical standardization of semiconductor devices - Part 6-9: General rules for the preparation of outline drawing of surface mounted semiconductor device packages Design Guideline for Plastic Quad Flat Package (P-QFP) More	Comment
IEC 47D/482/CDV	2000-09-15	IEC 60191-6-11, Ed.1: Mechanical standardization of semiconductor devices - Part 6-11: General design guidelines for rectangular Fine Pitch Ball Grid Array Packages (FBGA) More	Comment
IEC 47D/418/CDV	2000-03-31	IEC 60191-2, F51, Ed.1: Plastic enhanced thin profile quad flatpack (HTQFP) outline family, heat slug up T-PQFP-G (If approved, to be published as Outline 152E-a-l) More	Comment
IEC 47D/534/CDV	2000-03-31	IEC 60191-6-7 Ed.1: Mechanical standardization of semiconductor devices - Part 6-7: General rules for the dimensions of P-QFN More	Comment
IEC 47D/440/FDIS	1999-12-17	IEC 60191-2/F47, Ed.1: Proposal for 3-Leaded SMD (Body Size D×E : 2.9×1.5 mm) Outline Family 162E More	Comment
IEC 47D/316A/CD	1999-08-20	REPLACEMENT OF Document 47D/316/CD: Proposal for 60 and 90 pin P-FBGA (Plastic Fine pitch Ball Grid Array), 0,8 mm pitch More	Comment
IEC 47D/314A/CD	1999-08-20	REPLACEMENT OF Document 47D/314/CD: Tape ball grid array package, 0,6 mm ball diameter family More	Comment

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