• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Projects of DKE/K 631

IEC 47/2085/FDIS 2008-01-25 IEC 62258-2 Ed.2: SEMICONDUCTOR DIE PRODUCTS - Part 2: Exchange data formats More  Comment 
IEC 47/1911A/DC 2007-06-15 Proposal of the French NC: Reliability engineering in electronics(Numbering of clauses/paragraphs) More  Comment 
IEC 47/1905/NP 2007-03-30 Proposal of the Korean NC: (Future IEC 62047-7): Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS FBAR Filter & Duplexer More  Comment 
IEC 47/1906/NP 2007-03-30 Proposal of the Korean NC: (Future IEC 62047-8): Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films More  Comment 
IEC 47/1907/NP 2007-03-30 Proposal of the Korean NC: (Future IEC 62047-9): Semiconductor devices - Micro-electromechanical devices - Part 9: Bonding strength measurement in MEMS packaging More  Comment 
IEC 47A/767/NP 2006-12-01 Future IEC 62433-1: EMC IC modelling - Part 1: General modelling framework More  Comment 
IEC 47/1881/NP 2006-07-28 Proposal of the French NC: Audit for obsolescence management More  Comment 
IEC 47/1868/NP 2006-05-26 (Future IEC 62047-6): Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials More  Comment 
IEC 110/85/NP 2006-05-26 (Future IEC 61747-5-3 Ed.1.0) Liquid crystal display devices - Part 5-3: Liquid crystal display devices - Glass strength and reliability More  Comment 
IEC 110/78/NP 2006-04-14 (Future IEC 61988-2-4) Plasma Display Panels - Part 2-4: Measuring methods - Visual quality More  Comment 

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