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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Projects of DKE/K 631

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IEC 47F/63/CDV	2009-07-03	IEC 62047-10 Ed.1.0: Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials More	Comment
IEC 47F/154/FDIS	2009-07-03	IEC 62047-11 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems More	Comment
IEC 47F/72/CDV	2009-07-03	IEC 62047-13 Ed.1: SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures More	Comment
IEC 47A/881/CDV	2009-04-24	IEC 62215-3 Ed.1: Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method More	Comment
IEC 47F/156/FDIS	2009-02-27	Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses More	Comment
IEC 47A/862/CD	2009-02-20	IEC 62132-6 Ed.1: Integrated circuits - Measurement ofelectromagnetic immunity - Part 6: Local Injection Horn Antenna (LIHA) method More	Comment
IEC 47A/809/DC	2009-01-16	Proposal from the Japanese National Committee for a new Technical Report, "EMC IC modelling Part x-x: Theory of black box modelling for conducted emission" More	Comment
IEC 47A/806/DC	2008-12-26	Technical report on near-field scan data exchange format More	Comment
IEC 47F/79/FDIS	2008-12-19	IEC 62047-7 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection More	Comment
IEC 47F/31/CDV	2008-11-28	IEC 62047-9,Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS More	Comment

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