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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Projects of DKE/K 631

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IEC 47F/46/NP	2010-02-26	(Future IEC 62047-17): Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films More	Comment
IEC 47F/47/NP	2010-02-26	(Future IEC 62047-18): Semiconductor devices - Micro-electromechanical devices - Part 18: Micro electro mechanical devises - Bending test methods of thin film materials More	Comment
IEC 47F/70/CDV	2009-10-30	IEC 62047-14 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials More	Comment
IEC 47F/38/NP	2009-10-30	(Future IEC 62047-15): Semiconductor devices -Micro-electromechanical devices - Part 15: Test method for bond strength in PDMS/Glass chip More	Comment
IEC 47F/39/NP	2009-10-30	(Future IEC 62047-16): Semiconductor devices -Micro-electromechanical devices - Part 16: Test method forresidual stress measurement More	Comment
IEC 47/2082/FDIS	2009-09-04	IEC 60749-21 Ed.2: Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability More	Comment
IEC 47/2083/FDIS	2009-09-04	IEC 60749-29 Ed.2: SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - Part 29: Latch-up test More	Comment
IEC 47A/840/DTS	2009-08-07	IEC/TS 62433-1 Ed.1: EMC IC Modelling, Part 1: General modelling framework More	Comment
IEC 47/2019/CDV	2009-07-31	IEC 60749-30 Amend 1 Ed.1: Semiconductor devices - Mechanical and climatic test methods -Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing More	Comment
IEC 47/2087/FDIS	2009-07-31	IEC 60749-7 Ed.2: Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases More	Comment

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