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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Projects of DKE/K 631

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IEC 47/2080/NP	2010-11-12	IEC 60749-28: Electrostatic Discharge (ESD) Sensitivity Testing Direct contact charged device model (DC-CDM) More	Comment
IEC 47/2073A/DTR	2010-09-10	IEC/TR 62258-4 Ed.2: Semiconductor die products - Part 4: Questionnaire for die users and suppliers More	Comment
IEC 47A/853/DC	2010-08-06	Review and Maintenance - call for comments/ proposals on publications coming up for review and a call for experts More	Comment
IEC 47/2064/NP	2010-07-16	Future IEC 62435: Long-term storage of electronic semiconductor devices More	Comment
IEC 47A/845/DC	2010-04-30	Proposed corrigendum to IEC 61967-6 Ed1.1 Consol. with am1: Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method More	Comment
IEC 47A/842/DC	2010-03-12	Proposed a new convenor of WG 2 (Logic digital integratedcircuits) of IEC SC 47A More	Comment
IEC 47F/46/NP	2010-02-26	(Future IEC 62047-17): Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films More	Comment
IEC 47F/47/NP	2010-02-26	(Future IEC 62047-18): Semiconductor devices - Micro-electromechanical devices - Part 18: Micro electro mechanical devises - Bending test methods of thin film materials More	Comment
IEC 47F/70/CDV	2009-10-30	IEC 62047-14 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials More	Comment
IEC 47F/38/NP	2009-10-30	(Future IEC 62047-15): Semiconductor devices -Micro-electromechanical devices - Part 15: Test method for bond strength in PDMS/Glass chip More	Comment

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