We use cookies to make our website more user-friendly and to continually improve it. Please agree to the use of cookies in order to proceed with using our websites. More information can be found in our data protection information and our cookie guidelines.

- Required
- Functional
- Personalization
- Required
  These cookies are essential for the operation of the site and enable, for example, security-relevant functions. In addition, we can also use this type of cookie to determine whether you want to remain logged in to your profile in order to make our services available to you more quickly when you visit our website again.
- Functional
  In order to further improve our offer and our website, we collect anonymized data for statistics and analysis. With the help of these cookies we can, for example, determine the number of visitors and the effect of certain pages on our website and optimize our content.
- Personalization
  We use these cookies to make it easier for you to use the site. For example, based on a previous (e.g. product search), you can conveniently access it when you visit our website again.

Attention: Your browser doesn't support javascript or you have deactivated Javascript in your browser. Please enable Javascript in your browser in order to be able to use all functions of this website.

Hydrogen Technologies Standards form the basic framework for market ramp-up
More information
Climate change Standards and specifications support climate targets
More information
Smart Farming Standards and specifications are drivers for the digitalization of agriculture
More information

Projects of DKE/K 631

Sort by:


IEC 47F/125/CD	2012-07-27	IEC 62047-16, Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods More	Comment
IEC 47/2155/CDV	2012-03-02	IEC 60749-28 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic Discharge (ESD) Sensitivity Testing Direct contact charged device model (DC-CDM) More	Comment
IEC 47F/106/NP	2011-09-30	Future IEC 62047-15: Semiconductor devices Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass More	Comment
IEC 47F/107/NP	2011-09-30	Future IEC 62047-16: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods More	Comment
IEC 47F/105/NP	2011-09-30	Future IEC 62047-23: Semiconductor devices - Micro-electromechanical devices - Part 23: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods More	Comment
IEC 47F/95/NP	2011-07-29	Future IEC 62047-21: Semiconductor devices - Micro-electromechanical devices Part 21: Test method for Poisson's ratio of thin film MEMS materials More	Comment
IEC 47F/96/NP	2011-07-29	Future IEC 62047-22: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates More	Comment
IEC 47F/91/NP	2011-07-22	Future IEC 62047-20: Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes More	Comment
IEC 47F/155/FDIS	2011-02-18	IEC 62047-18 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials More	Comment
IEC 47F/75/NP	2011-02-18	(Future IEC 62047-19) Semiconductor devices -Micro-electromechanical devices - Part 19: Electronic compasses More	Comment

4 / 12

TOP

Want to learn more?

Show

Preferred form of address

Male

Female

Neutral

First name*

Last name*

E-mail*

Phone no.

Subject

???din.label.contact.mailSubject???

Message*

Security code*

Here you can find our privacy policy

*Required field