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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Projects of DKE/K 631

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DIN EN 63011-3	2017-01-24	Integrated circuits - Three dimensional integrated circuits - Part 3: A model and measurement conditions of through silicon via (IEC 47A/997/CD:2016) More	Comment
IEC 47F/147A/CDV	2013-04-05	IEC 62047-21 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials More	Comment
IEC 47F/148/CDV	2013-03-29	IEC 62047-22 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates More	Comment
IEC 47F/151/CD	2013-03-22	IEC 62047-16 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films?wafer curvature and cantilever beam deflection methods More	Comment
IEC 47F/149/CD	2013-02-22	IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass More	Comment
IEC 47A/899/CD	2013-02-01	IEC 62132-1 Ed.2: Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions More	Comment
IEC 47F/146/CD	2013-01-11	IEC 62047-17 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films More	Comment
IEC 47F/127/CD	2012-08-10	IEC 62047-21 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials More	Comment
IEC 47F/128/CD	2012-08-10	IEC 62047-22 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates More	Comment
IEC 47F/126/CD	2012-08-03	IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding quality between PDMS and glass More	Comment

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