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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Projects of DKE/K 631

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DIN IEC 63150-3	2022-05-03	Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 3: Human foot impact motion (IEC 47/2758/CD:2022); Text in German and English More	Comment
DIN EN IEC 63364-1	2022-03-22	Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of sound variation detection (IEC 63364-1:2022); German version EN IEC 63364-1:2023 More	Comment
DIN EN IEC 60749-20-1	2018-07-30	Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018 More	Comment
DIN EN 63011-1	2017-01-24	Integrated circuits - Three dimensional integrated circuits - Part 1: General conditions and definitions (IEC 47A/996/CD:2016) More	Comment
DIN EN 63011-3	2017-01-24	Integrated circuits - Three dimensional integrated circuits - Part 3: A model and measurement conditions of through silicon via (IEC 47A/997/CD:2016) More	Comment
IEC 47F/147A/CDV	2013-04-05	IEC 62047-21 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials More	Comment
IEC 47F/148/CDV	2013-03-29	IEC 62047-22 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates More	Comment
IEC 47F/151/CD	2013-03-22	IEC 62047-16 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films?wafer curvature and cantilever beam deflection methods More	Comment
IEC 47F/149/CD	2013-02-22	IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass More	Comment
IEC 47A/899/CD	2013-02-01	IEC 62132-1 Ed.2: Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions More	Comment

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