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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Projects of DKE/K 631

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DIN EN IEC 61967-8	2022-05-03	Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method (IEC 61967-8:2023); German version EN IEC 61967-8:2023 More	Comment
DIN EN IEC 63364-1	2022-03-22	Semiconductor devices - Semiconductor devices for IOT system - Part 1: Test method of sound variation detection (IEC 47/2742/CDV:2021); German and English version prEN IEC 63364-1:2021 More	Comment
DIN EN IEC 60749-28	2022-03-22	Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level (IEC 60749-28:2022); German version EN IEC 60749-28:2022 More	Comment
DIN EN IEC 63287-2	2021-06-25	Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile (IEC 63287-2:2023); German version EN IEC 63287-2:2023 More	Comment
DIN EN IEC 60749-20-1	2018-07-30	Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018 More	Comment
DIN EN 62433-6	2017-08-16	EMC IC modelling - Part 6: Models of integrated circuits for Pulse immunity behavioural simulation - Conducted Pulse Immunity (ICIM-CPI) (IEC 47A/1019/CD:2017) More	Comment
DIN EN 63011-1	2017-01-24	Integrated circuits - Three dimensional integrated circuits - Part 1: General conditions and definitions (IEC 47A/996/CD:2016) More	Comment
DIN EN 63011-3	2017-01-24	Integrated circuits - Three dimensional integrated circuits - Part 3: A model and measurement conditions of through silicon via (IEC 47A/997/CD:2016) More	Comment
IEC 47F/147A/CDV	2013-04-05	IEC 62047-21 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials More	Comment
IEC 47F/148/CDV	2013-03-29	IEC 62047-22 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates More	Comment

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