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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Projects of IEC/TC 91

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IEC 91/378/NP	2003-03-07	IEC 61190-1-6: Attachment materials for electronic assembly - Part-1-6: Requirements for electronic grade lead free solder alloys and fluxed and non-fluxed lead free solid solder for electronic soldering applications More	Comment
IEC 91/379/NP	2003-03-07	IEC 61190-1-7: Attachment materials for electronic assembly - Part-1-7: Requirements for lead free solder pastes for high quality interconnections in electronics assembly More	Comment
IEC 93/167A/NP	2002-12-06	Comments received on 93/167/NP (Interoperability Verilog and VHDL (Technical report)) More	Comment
IEC 93/166A/NP	2002-12-06	Comments received on 93/166/NP (IEC 61926-2: Standard Test Languages - Part 2: Test Language for All Systems Requirements) More	Comment
IEC 93/162A/NP	2002-12-06	Comments received on 93/162/NP (A standard for an Advanced Library Format (ALF) describing Integrated Circuit (IC) technology, cells, and blocks) More	Comment
IEC 93/165A/NP	2002-12-06	Comments received on 93/165/NP (Standard Delay Format (SDF) for the Electronic Design Process) More	Comment
IEC 93/170/NP	2002-11-29	IEC 61691-4: Behavioural Languages - Part 4: Standard Hardware Description Language based on Verilog 2001 More	Comment
IEC 93/168/NP	2002-11-01	IEC 61691-5 Behavioural Languages; Part 5; Standard Hardware Description Language based on VHDL 2002 More	Comment
IEC 93/165/NP	2002-10-04	Standard Delay Format (SDF) for the Electronic Design Process More	Comment
IEC 93/155/DTR	2002-08-16	IEC 62014-4: Cookbook for integrated Circuit model IECM described in IEC 62014-3 More	Comment

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