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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Projects of IEC/TC 91

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IEC 91/476/NP	2004-08-20	Marking, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices More	Comment
IEC 93/204/NP	2004-08-13	Interoperability of Formats and Schemas used for Electronic Assembly Material Declaration More	Comment
IEC 91/469/NP	2004-07-02	Specification for Flexible Optical Board using Glass Fibre and its test methods More	Comment
IEC 91/470/NP	2004-07-02	Specification for rigid optical board using planar waveguide and its test methods More	Comment
IEC 91/471/NP	2004-07-02	Specification for optical board connector type SF using glass fibre More	Comment
IEC 93/201/DC	2004-05-14	Withdrawal of two New Work Item Proposals from the programme of work More	Comment
IEC 91/432/NP	2003-10-17	IEC xxx-xx: Test methods for lead-free solders - Part 1: Measurement of melting temperature ranges More	Comment
IEC 91/433/NP	2003-10-17	IEC xxx-xx: Test methods for lead-free solder - Part 2: Testing of mechanical characteristics More	Comment
IEC 91/407/NP	2003-07-11	IEC 61188-5-7 Design and use of printed boards and printed board assemblies - Part 5-7: Sectional requirements attachment (land/joint) considerations - components with post mounting leads on two sides (dips) More	Comment
IEC 91/405/NP	2003-07-11	IEC 61249-1-1: Materials for printed boards and other interconnection structures - Part 1-1: Safety certification of base materials for rigid printed circuit boards More	Comment

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