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Projects of IEC/TC 91

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IEC 91/692/NP	2007-06-15	Proposal from Chinese NC: Future IEC 61249-2-42: Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass resinforced laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly More	Comment
IEC 91/616/NP	2006-07-21	Proposal of the JPNC: NP-PAS - Copper-Clad Laminate for Flexible Printed Wiring Boards (Adhesive and Non-adhesive types) More	Comment
IEC 91/615/NP	2006-07-21	Proposal of the JPNC: NP-PAS - Performance guide for single- and double-sided flexible printed wiring boards More	Comment
IEC 91/642/CDV	2006-07-14	IEC 62468 Ed.1 : The marking for the presence and absence of the specified chemical substances in materials, components and mounted boards used in electrical and electronic equipment More	Comment
IEC 91/663/CDV	2006-04-28	NP-CDV: IEC 61249-4-14, Ed. 1: Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly More	Comment
IEC 91/592/NP	2006-04-28	IEC 61249-4-15: Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly More	Comment
IEC 91/594/NP	2006-04-28	IEC 61249-4-16: Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly More	Comment
IEC 91/595/NP	2006-04-28	IEC 61249-4-17: Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly More	Comment
IEC 91/596/NP	2006-04-28	IEC 61249-2-36: Materials for printed boards and other interconnecting structures - Part 2-36: Sectional specification set for reinforced based materials, clad and unclad - Epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly More	Comment
IEC 91/597/NP	2006-04-28	IEC 61249-2-37: Materials for printed boards and other interconnecting structures - Part 2-37: Sectional specification set for reinforced based materials, clad and unclad - Multi-functional, non-halogenated epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly More	Comment

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