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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Projects of IEC/TC 91

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IEC 91/905/CDV	2008-11-07	IEC 61182-2-2: Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description More	Comment
IEC 91/969/CD	2008-10-10	IEC 61189-11 Ed.1: Test methods for electrical materials,interconnection structures and assemblies - Part 11: Measurement of melting temperature and melting temperature ranges of solder alloys More	Comment
IEC 91/800A/DC	2008-09-19	Proposal for Amendment to IEC 61190-1-3 Ed. 2 (Lead-free solder alloys) - Additional information and extension of closing date from 2008-09-26 to 2008-10-03 More	Comment
IEC 91/805/NP	2008-08-29	Future IEC 61189-2-628 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis (DMA; bend and pull) More	Comment
IEC 91/806/NP	2008-08-29	Future IEC 61189-2-719 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-716: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (500MHz to 10GHz) More	Comment
IEC 91/807/NP	2008-08-29	Future IEC 61189-2-720 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (1MHz) More	Comment
IEC 91/804/DC	2008-08-29	Review of 91/761/DC: "How to advance the PT 62468 document" More	Comment
IEC 91/924/CDV	2008-07-25	IEC62137-3 Ed.1: Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints More	Comment
IEC 91/860/CD	2008-04-18	(Future IEC 61188-8-1): Component shape data specification for CAD library - Part 8-1 Generic Descriptions of the 2D and 3D description More	Comment
IEC 91/761/DC	2008-04-11	Proposal on "How to advance the PT 62468 document" - The marking for the presence and absence of the specified chemical substances in materials, components and mounted boards used in electrical and electronic equipment More	Comment

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