• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Publications of DKE/K 682

DIN EN 61189-5-3 2015-11 Standards Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015); German version EN 61189-5-3:2015 More  Order from DIN Media
DIN EN 61189-5-4 2015-11 Standards Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015); German version EN 61189-5-4:2015 More  Order from DIN Media
DIN EN 61189-5-503 2018-01 Standards Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017); German version EN 61189-5-503:2017 More  Order from DIN Media
DIN EN 61189-6 2007-03 Standards Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies (IEC 61189-6:2006); German version EN 61189-6:2006 More  Order from DIN Media
DIN EN 61189-11 2014-02 Standards Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013); German version EN 61189-11:2013 More  Order from DIN Media
DIN EN 61190-1-1 2003-01 Standards Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002); German version EN 61190-1-1:2002 More  Order from DIN Media
DIN EN 61190-1-2 2014-11 Standards Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014 More  Order from DIN Media
DIN EN 61191-2 2018-05 Standards Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017 More  Order from DIN Media
DIN EN 61191-2 Berichtigung 1 2020-02 Standards Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017/COR1:2019); German version EN 61191-2:2017/AC:2019 More  Order from DIN Media
DIN EN 61191-3 2018-05 Standards Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017 More  Order from DIN Media

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