• Hydrogen Technologies Standards form the basic framework for market ramp-up

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  • Climate change Standards and specifications support climate targets

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  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

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Publications of DKE/K 682

DIN EN IEC 62878-2-602 2022-08 Standards Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 62878-2-602:2021); German version EN IEC 62878-2-602:2021 More  Order from DIN Media
DIN EN IEC 62878-2-603 2023-07 Draft standard Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 91/1802/CD:2022); Text in German and English More  Order from DIN Media
DIN EN IEC 63215-2 2021-01 Draft standard Endurance test methods for die attach materials applied to power electronics devices - Part 2: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices (IEC 91/1660/CD:2020); Text in German and English More  Order from DIN Media
DIN EN IEC 63215-5 2022-06 Draft standard Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices (IEC 91/1770/CD:2021); Text in German and English More  Order from DIN Media
DIN EN IEC 63251 ; VDE 0885-201:2024-07 2024-07 Standards Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress (IEC 63251:2023); German version EN IEC 63251:2023 More  Order from DIN Media
DIN IEC/TS 62647-1 ; DIN SPEC 42647-1:2013-07 2013-07 Technical Specification Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan (IEC/TS 62647-1:2012) More  Order from DIN Media
DIN IEC/TS 62647-2 ; DIN SPEC 42647-2:2013-09 2013-09 Technical Specification Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin (IEC/TS 62647-2:2012) More  Order from DIN Media
DIN IEC 60249-3-3 1994-06 Standards Base materials for printed circuits; part 3: special materials; specification No. 3: permanent polymer coating materials (solder-resist) for use in the fabrication of printed boards; identical with IEC 60249-3-3:1991 More  Order from DIN Media

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