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DIN EN IEC 61189-5-501
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2022-08
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Standards
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (IEC 61189-5-501:2021); German version EN IEC 61189-5-501:2021
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DIN EN IEC 61189-5-502
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2022-05
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Standards
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Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (IEC 61189-5-502:2021); German version EN IEC 61189-5-502:2021
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DIN EN IEC 61189-5-504
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2021-09
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Standards
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Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (IEC 61189-5-504:2020); German version EN IEC 61189-5-504:2020
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DIN EN IEC 61189-5-601
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2022-12
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Standards
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (IEC 61189-5-601:2021); German version EN IEC 61189-5-601:2021
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DIN EN IEC 61190-1-3
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2018-09
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Standards
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Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018
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DIN EN IEC 61191-1
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2019-06
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Standards
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Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018); German version EN IEC 61191-1:2018
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DIN EN IEC 61249-2-45
; VDE 0322-249-2-45
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2018-10
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Standards
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Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-45:2018); German version EN IEC 61249-2-45:2018
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DIN EN IEC 61249-2-46
; VDE 0322-249-2-46
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2018-10
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Standards
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Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-46:2018); German version EN IEC 61249-2-46:2018
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DIN EN IEC 61249-2-47
; VDE 0322-249-2-47
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2018-10
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Standards
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Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2.0 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-47:2018); German version EN IEC 61249-2-47:2018
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DIN EN IEC 61249-2-51
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2024-02
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Standards
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Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad (IEC 61249-2-51:2023); German version EN IEC 61249-2-51:2023
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