We use cookies to make our website more user-friendly and to continually improve it. Please agree to the use of cookies in order to proceed with using our websites. More information can be found in our data protection information and our cookie guidelines.

- Required
- Functional
- Personalization
- Required
  These cookies are essential for the operation of the site and enable, for example, security-relevant functions. In addition, we can also use this type of cookie to determine whether you want to remain logged in to your profile in order to make our services available to you more quickly when you visit our website again.
- Functional
  In order to further improve our offer and our website, we collect anonymized data for statistics and analysis. With the help of these cookies we can, for example, determine the number of visitors and the effect of certain pages on our website and optimize our content.
- Personalization
  We use these cookies to make it easier for you to use the site. For example, based on a previous (e.g. product search), you can conveniently access it when you visit our website again.

Attention: Your browser doesn't support javascript or you have deactivated Javascript in your browser. Please enable Javascript in your browser in order to be able to use all functions of this website.

Hydrogen Technologies Standards form the basic framework for market ramp-up
More information
Climate change Standards and specifications support climate targets
More information
Smart Farming Standards and specifications are drivers for the digitalization of agriculture
More information

Publications of DKE/K 631

Sort by:


DIN EN 62215-3 ; VDE 0847-23-3:2014-04	2014-04	Standards	Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method (IEC 62215-3:2013); German version EN 62215-3:2013 More	Order from DIN Media
DIN EN 62228-2 ; VDE 0847-28-2:2017-09	2017-09	Standards	Integrated circuits - EMC evaluation of transceivers - Part 2: LIN transceivers (IEC 62228-2:2016); German version EN 62228-2:2017 More	Order from DIN Media
DIN EN 62258-1 ; VDE 0884-101:2011-04	2011-04	Standards	Semiconductor die products - Part 1: Procurement and use (IEC 62258-1:2009); German version EN 62258-1:2010 More	Order from DIN Media
DIN EN 62258-2	2011-12	Standards	Semiconductor die products - Part 2: Exchange data formats (IEC 62258-2:2011); English version EN 62258-2:2011 More	Order from DIN Media
DIN EN 62258-5	2007-02	Standards	Semiconductor die products - Part 5: Requirements for information concerning electrical simulation (IEC 62258-5:2006); German version EN 62258-5:2006 More	Order from DIN Media
DIN EN 62258-6	2007-02	Standards	Semiconductor die products - Part 6: Requirements for information concerning thermal simulation (IEC 62258-6:2006); German version EN 62258-6:2006 More	Order from DIN Media
DIN EN 62373	2007-01	Standards	Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) (IEC 62373:2006); German version EN 62373:2006 More	Order from DIN Media
DIN EN 62374	2008-02	Standards	Semiconductor devices - Time Dependent Dielectric Breakdown (TDDB) test for gate dielectric films (IEC 62374:2007); German version EN 62374:2007 More	Order from DIN Media
DIN EN 62374-1	2011-06	Standards	Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers (IEC 62374-1:2010); German version EN 62374-1:2010 + AC:2011 More	Order from DIN Media
DIN EN 62415	2010-12	Standards	Semiconductor devices - Constant current electromigration test (IEC 62415:2010); German version EN 62415:2010 More	Order from DIN Media

8 / 16

TOP

Want to learn more?

Show

Preferred form of address

Male

Female

Neutral

First name*

Last name*

E-mail*

Phone no.

Subject

???din.label.contact.mailSubject???

Message*

Security code*

Here you can find our privacy policy

*Required field