(Future IEC 62047-6): Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

Proposal of the Korean NC: (Future IEC 62047-8): Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

IEC 191-6: General rules for TSOP (Thin Small Outline Package) Type II

IEC 60191-2: Proposal for a plastic thin shrink small outline package (TSSOP/HTSSOP), 1,00 mm lead length outline family, R-PDSO-G

Proposed new package outline for P-DHVQFN family. (Plastic Dual in-line compatible Heatsink Very thin Quad Flat Pack No Leads). If approved, to be included in IEC 60191-2 serie

(Future IEC 62047-17): Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

(Future IEC 62047-18): Semiconductor devices - Micro-electromechanical devices - Part 18: Micro electro mechanical devises - Bending test methods of thin film materials

Future IEC 62047-21: Semiconductor devices - Micro-electromechanical devices Part 21: Test method for Poisson's ratio of thin film MEMS materials

Future IEC 62047-22: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

IEC 62047-21 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials