IEC 68-2-69: Solderability testing of electronic components for surface mount technology by the wetting balance method

Environmental Testing - Part X: Tests - Test: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste

IEC 60068-2-20 Ed. 5: Basic environmental testing procedures: Part 2: Tests - Test T: Test methods for solderability and resistance to soldering heat of leaded devices

IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

IEC 60749-21 Ed.2: Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

IEC 60068-2-83 Ed.1: Environmental Testing - Part 2-83: Tests-test Tf: Solderability testing of electronic components forsurface mounting devices (SMD) by the wetting balance method using solder paste