Revised Future IEC 60674-3-8 Ed. 1.0: Specification for plastic films for electrical purposes - Part 3: Specifications for individual materials - Sheet 8: Requirements for balanced biaxially oriented polyethylene naphthalate (PEN) films used for electrical insulation

IEC 60674-3-8 Ed. 1.0: Specification for plastic films for electrical purposes - Part 3: Specifications for individual materials - Sheet 8: Requirements for balanced biaxially oriented polyethylenenaphthalate (PEN) films used for electrical insulation

Proposal of the Japanese NC: Packaging of components for automatic handling - Part X: Reusable and/or recyclable plastic reels

IEC 60191-2: Proposal for a plastic thin shrink small outline package (TSSOP/HTSSOP), 1,00 mm lead length outline family, R-PDSO-G

Proposal of the Japanese NC: The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2)

Proposal of the Japanese NC: The individual standard for 32&48 pins plastic fine pitch ball grid array (P-FBGA), 0,8 mm terminal pitch (Intended for inclusion into IEC 191-2)

Proposal of the Japanese NC: The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2)

Proposal of the Japanese NC: The individual standard for 0,8 mm pitch plastic fine pitch ball grid array (P-FBGA) family (Intended for inclusion into IEC 191-2)

REPLACEMENT OF Document 47D/316/CD: Proposal for 60 and 90 pin P-FBGA (Plastic Fine pitch Ball Grid Array), 0,8 mm pitch

Proposed new package outline for P-DHVQFN family. (Plastic Dual in-line compatible Heatsink Very thin Quad Flat Pack No Leads). If approved, to be included in IEC 60191-2 serie