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DIN EN IEC 63378-4
Thermal standardization on semiconductor packages - Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages
IEC 46C/929/RR
Review report on IEC 60918 Ed. 1.0: PVC insulated ribbon cable with a pitch of 1.27 mm suitable for insulation displacement termination
IEC 46C/930/RR
Review report on IEC 60918 Amd.1 Ed. 1.0: Amendment 1 - PVC insulated ribbon cable with a pitch of 1.27 mm suitable for insulation displacement termination
IEC 47D/210/NP
Proposal of the Japanese NC: The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2)
IEC 47D/211/NP
Proposal of the Japanese NC: The individual standard for 32&48 pins plastic fine pitch ball grid array (P-FBGA), 0,8 mm terminal pitch (Intended for inclusion into IEC 191-2)
IEC 47D/213/NP
Proposal of the Japanese NC: The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2)
IEC 47D/214/NP
Proposal of the Japanese NC: The individual standard for 0,8 mm pitch plastic fine pitch ball grid array (P-FBGA) family (Intended for inclusion into IEC 191-2)
IEC 47D/316A/CD
REPLACEMENT OF Document 47D/316/CD: Proposal for 60 and 90 pin P-FBGA (Plastic Fine pitch Ball Grid Array), 0,8 mm pitch
IEC 47D/539/NP
Proposed new package outline, DDRII SDRAM Family, 1,00 mm contact pitch
IEC 47D/539A/NP
RESUBMISSION: Proposed new package outline, DDRII SDRAM Family, 1,00 mm contact pitch (ex 47D/539/NP)
