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IEC 47D/170/CDV
IEC 191-6: General rules for TSOP (Thin Small Outline Package) Type II
IEC 47D/229/NP
Proposal of the USNC: Common package unit design guide for BGA packages
IEC 47D/252/NP
Proposal of the Japanese NC: BGA (Ball Grid Array) package measuring method
IEC 47D/314/CD
Tape Ball Grid Array package, 0.6 mm ball diameter family (Intended for inclusion in 60191-2)
IEC 47D/503/NP
Proposed new package outline, 3/4-land SMD (If approved, to be included in IEC 60191-2)
IEC 47D/523/NP
Proposed new package outline for P-DHVQFN family. (Plastic Dual in-line compatible Heatsink Very thin Quad Flat Pack No Leads). If approved, to be included in IEC 60191-2 serie
IEC 47D/539/NP
Proposed new package outline, DDRII SDRAM Family, 1,00 mm contact pitch
IEC 47D/539A/NP
RESUBMISSION: Proposed new package outline, DDRII SDRAM Family, 1,00 mm contact pitch (ex 47D/539/NP)
IEC 47D/540/NP
Proposed new package outline, Plastic, small outline family, 1,27 mm pitch, 7,5 mm body width and 14, 16, 18, 20, 24 and 28 lead counts
IEC 47D/542/NP
Proposed new package outline, Plastic small outline family, 1,27 mm pitch, 3,9 mm body width, 8, 14 and 16 leads
