(Future IEC 62047-6): Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

Proposal of the Korean NC: (Future IEC 62047-7): Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS FBAR Filter & Duplexer

Proposal of the Korean NC: (Future IEC 62047-8): Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

Proposal of the Korean NC: (Future IEC 62047-9): Semiconductor devices - Micro-electromechanical devices - Part 9: Bonding strength measurement in MEMS packaging

Proposed new package outline - 10 pin micro size Multimedia Card (MMC) outline MMCmicro 14×12×1,1 mm (Intended to become IEC 60191-2/F66, if approved)

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (Future IEC 62047-10)

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials (Future IEC 62047-11)

(Future IEC 62047-15): Semiconductor devices -Micro-electromechanical devices - Part 15: Test method for bond strength in PDMS/Glass chip

(Future IEC 62047-16): Semiconductor devices -Micro-electromechanical devices - Part 16: Test method forresidual stress measurement

(Future IEC 62047-17): Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films