Measurement method used in thermal design for electronics assemblies - Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized SMDs where the heat dissipation path to the board is dominant

Measurement method used in thermal design for electronics assemblies - - Part 3: Temperature measurement method for miniaturized SMDs on circuit boards

IEC 60749-40 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

Draft detail specification IEC 61076-4-112: Connectors with assessed quality, for use in d.c., low-frequency analogue and digital high speed data applications - Part 4: Two-part connectors for printed boards for basic grid of 2.00 mm, with square male con

Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors

Passive filter units for electromagnetic interference suppression - Part 3: Passive filter units for which safety tests are appropriate (IEC 60939-3:2024); German version EN IEC 60939-3:2024

Fibre optic active components and devices - Package and interface standards - Part 2: SFF 10-pin transceivers

Fibre optic active components and devices - Package and interface standards - Part 11: 14-pin modulator integrated laser diode modules and pump laser diode modules

Fibre optic interconnecting devices and passive components - Performance standard - Part 081-02: Non-connectorized single-mode fibre optic middle-scale 1×N DWDM devices for category C - Controlled environments (IEC 61753-081-02:2023); German version EN IEC 61753-081-02:2023

Fibre optic interconnecting devices and passive components - Performance standard - Part 081-03: Non-connectorized single-mode fibre optic middle-scale 1×N DWDM devices for category OP - Outdoor protected environment (IEC 61753-081-03:2023); German version EN IEC 61753-081-03:2023