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Project

DIN EN IEC 62878-2-603

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 91/1802/CD:2022); Text in German and English

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DIN 91357

Open Urban Platform (OUP) reference architecture model

Project

DIN CWA 16926-77

Extensions for Financial Services (XFS) interface specification Release 3.40 - Part 77: Item Processing Module Device Class Interface - Migration from version 3.30 (CWA 16926) to Version 3.40 (this CWA) - Programmer's Reference

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