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IEC/TC 107/MT 3
Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
IEC 107/109/NP
Aerospace and military electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin in high-reliability electronic systems (IEC/PAS 62647-2)
IEC 107/108/PAS
IEC/PAS 62647-2 Ed.1: Aerospace and military electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin in high-reliability electronic systems
IEC 107/125/NP
Future IEC 62686-1 Ed.1: General Requirements for High Reliability Components - Part 1: Integrated Circuits and Discrete Semiconductors
IEC 107/126/PAS
Future IEC/PAS 62686-1 Ed.1: General Requirements for High Reliability Components - Part 1: Integrated Circuits and Discrete Semiconductors
