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Project
IEC 47D/523/NP
Proposed new package outline for P-DHVQFN family. (Plastic Dual in-line compatible Heatsink Very thin Quad Flat Pack No Leads). If approved, to be included in IEC 60191-2 serie
Project
IEC 47D/418/CDV
IEC 60191-2, F51, Ed.1: Plastic enhanced thin profile quad flatpack (HTQFP) outline family, heat slug up T-PQFP-G (If approved, to be published as Outline 152E-a-l)
