Modification of IEC 60851-5: Winding wires - Test methods - Part 5: Electrical properties - Clause 4: Breakdown voltage - Clause 6: Dielectric dissipation factor (IEC 55/712/CD:1999)

Future IEC 61189-2-719 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-716: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (500MHz to 10GHz)

Future IEC 61189-2-720 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (1MHz)

Measurement method used in thermal design for electronics assemblies - Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized SMDs where the heat dissipation path to the board is dominant

Fibre optic interconnecting devices and passive components - Performance standard - Part 022-13: Fibre optic connectors terminated on multimode fibre for category OP+HD - Extended outdoor protected environment with additional heat dissipation (IEC 86B/4446/CD:2021); Text in German and English

Dielectric and resistive properties of solid insulating materials - Part 2-3: Determination of relative permittivity and dielectric dissipation factor (AC methods) - Contact electrode method for insulating films (IEC 112/603/CDV:2023); German and English version prEN IEC 62631-2-3:2023

Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications