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IEC 47F/105/NP
Future IEC 62047-23: Semiconductor devices - Micro-electromechanical devices - Part 23: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods
IEC 47F/107/NP
Future IEC 62047-16: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods
IEC 47F/125/CD
IEC 62047-16, Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
IEC 47F/151/CD
IEC 62047-16 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films?wafer curvature and cantilever beam deflection methods
IEC 48B/1575/CD
IEC 60512-16-18 Ed.1: CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - Part 16-18: Mechanical tests on contacts and terminations - Test 16r: Deflection of male contacts in a connector insert by simulation
ISO/DIS 75-3
Plastics - Determination of temperature of deflection under load - Part 3: High-strength thermosetting laminates and long-fibre-reinforced plastics
prEN ISO 75-3
Plastics - Determination of temperature of deflection under load - Part 3: High-strength thermosetting laminates and long-fibre-reinforced plastics (ISO/DIS 75-3:2024)
ISO/DIS 10471
Glass-reinforced thermosetting plastics (GRP) pipes - Determination of the long-term ultimate bending strain and the long-term ultimate relative ring deflection under wet conditions
DIN EN ISO 75-3
Plastics - Determination of temperature of deflection under load - Part 3: High-strength thermosetting laminates and long-fibre-reinforced plastics (ISO/DIS 75-3:2024); German and English version prEN ISO 75-3:2024
