Future IEC 62047-23: Semiconductor devices - Micro-electromechanical devices - Part 23: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods

Future IEC 62047-16: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods

IEC 62047-16, Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

IEC 62047-16 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films?wafer curvature and cantilever beam deflection methods

Composites and reinforcements fibres - Carbon fibre reinforced plastics(CFRPs) and metal assemblies --Evaluation of fatigue crack growth of bonded plates using double cantilever beam specimens under mode I (opening mode) loading