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DIN IEC 63150-3
Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 3: Human foot impact motion (IEC 47/2758/CD:2022); Text in German and English
NA 087-00-17-01 UA -dormant
Environmental conditions
NA 122-02 FB
Section Machine Tools - Test Conditions
IEC/TC 104
Environmental conditions, classification and methods of test
CEN/TC 246/WG 3
Product specifications
ISO/TC 17/SC 19
Technical delivery conditions for steel tubes for pressure purposes
CEN/TC 190/WG 1
Technical conditions of delivery and cast material designation
NA 036-00-04 AA
Geometrical product specifications (GPS) and technical conditions of delivery
CEN/WS ARCH
City Resilience Development – Framework and guidance for implementation in historic areas
CEN/TC 319/WG 12
Risk based inspection framework (RBIF)