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IEC 47D/210/NP
Proposal of the Japanese NC: The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2)
IEC 47D/211/NP
Proposal of the Japanese NC: The individual standard for 32&48 pins plastic fine pitch ball grid array (P-FBGA), 0,8 mm terminal pitch (Intended for inclusion into IEC 191-2)
IEC 47D/213/NP
Proposal of the Japanese NC: The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2)
IEC 47D/214/NP
Proposal of the Japanese NC: The individual standard for 0,8 mm pitch plastic fine pitch ball grid array (P-FBGA) family (Intended for inclusion into IEC 191-2)
IEC 47D/252/NP
Proposal of the Japanese NC: BGA (Ball Grid Array) package measuring method
IEC 47D/314/CD
Tape Ball Grid Array package, 0.6 mm ball diameter family (Intended for inclusion in 60191-2)
IEC 47D/314A/CD
REPLACEMENT OF Document 47D/314/CD: Tape ball grid array package, 0,6 mm ball diameter family
IEC 47D/316A/CD
REPLACEMENT OF Document 47D/316/CD: Proposal for 60 and 90 pin P-FBGA (Plastic Fine pitch Ball Grid Array), 0,8 mm pitch
IEC 47D/652/NP
Design guide for semiconductor packages - Ball Grid Array Package (BGA)
IEC 47D/653/NP
Design Guide for Stacked Packages and Individual Stackable packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA)
