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IEC 25/N1690A/RES
Approved resolutions of the 20th plenary of SC 25, Beijing, China, 2009-09-11
IEC 25/N1845/RES
Approved resolutions of the 21st plenary of SC 25, Seattle, USA, 2010-10-22
IEC 25/N1714/RES
JTC 1 resolutions as approved at the 24th plenary 2009-10-18/22 Tel Aviv, Israel
IEC 47D/503/NP
Proposed new package outline, 3/4-land SMD (If approved, to be included in IEC 60191-2)
IEC 47D/674/NP
Proposal of USNC: Proposed new package outline - 13 Pin reduced size MultiMediaCard (MMC) outline MMCmobile 18×24×1,4 mm (Intended to become IEC 60191-2/F65, if approved)
IEC 47D/675/NP
Proposed new package outline - 10 pin micro size Multimedia Card (MMC) outline MMCmicro 14×12×1,1 mm (Intended to become IEC 60191-2/F66, if approved)
IEC 47D/676/NP
Proposed new package outline - 13 Pin full size Multimedia Card (MMC) Outline MMCplus 32×24×1,4 mm (Intended to become IEC 60191-2/F67, if approved)
IEC 47D/787/CD
IEC 60191-2/f66 Ed.1: Proposed new package outline - large power package with 4 load terminals, P-UMP-A4. To be published as outline 184B, if approved.
IEC 47D/817A/CDV
IEC 60191-2 f67 Ed.1: Proposed new package outline - large power package with 6 load terminals, P-UMP-A6. To be published as outline 185B, if approved.
IEC 47D/818/CDV
IEC 60191-2 f68 Ed.1: Proposed new package outline - flange mounted package with through hole leads, P-SFM-T3 - To be published as outline 186F, if approved.
