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IEC/TC 47/WG 5
Wafer Level Reliability for semiconductor devices
IEC/TC 113/WG 13
Wafer-Scale System Integration
CLC/TC 82/WG 01
Wafers, cells and modules
IEC 47F/31/CDV
IEC 62047-9,Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
IEC 47F/107/NP
Future IEC 62047-16: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods
IEC 47F/151/CD
IEC 62047-16 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films?wafer curvature and cantilever beam deflection methods
IEC 47F/105/NP
Future IEC 62047-23: Semiconductor devices - Micro-electromechanical devices - Part 23: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods
IEC 47F/125/CD
IEC 62047-16, Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
IEC 49/927/CDV
IEC 62276 Ed.2: Single Crystal Wafers for Surface Acoustic Wave (SAW) devices applications - specicication and measuring method.
DIN EN IEC 62276
Single crystal wafers for surface acoustic wave (SAW) device applications - Specifications and measuring methods (IEC 49/1401/CD:2022); Text in German and English
