Fixed resistors for use in electronic equipment - Part 2-10: Blank detail specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G

Fixed resistors for use in electronic equipment - art 2: Sectional specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT)

Fixed resistors for use in electronic equipment - Part 4: Sectional specification: Power resistors for through hole assembly on circuit boards (THT) or for assembly on chassis

Generic specification: Printed boards

Fixed resistors for use in electronic equipment - Part 4-10: Blank detail specification: Power resistors with axial leads for through-hole assembly on circuit boards (THT), for general electronic equipment - Classification level G

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 61189-2-720:2024); German version EN IEC 61189-2-720:2024

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA (IEC 91/1696/CD:2020); Text in German and English

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021); Text in German and English