Measurement method used in thermal design for electronics assemblies - Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized SMDs where the heat dissipation path to the board is dominant

IEC 60749-40 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

Measurement method used in thermal design for electronics assemblies - - Part 3: Temperature measurement method for miniaturized SMDs on circuit boards

Draft detail specification IEC 61076-4-112: Connectors with assessed quality, for use in d.c., low-frequency analogue and digital high speed data applications - Part 4: Two-part connectors for printed boards for basic grid of 2.00 mm, with square male con

Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors

Passive filter units for electromagnetic interference suppression - Part 3: Passive filter units for which safety tests are appropriate (IEC 60939-3:2024); German version EN IEC 60939-3:2024

Fibre optic active components and devices - Package and interface standards - Part 2: SFF 10-pin transceivers

Fibre optic active components and devices - Package and interface standards - Part 11: 14-pin modulator integrated laser diode modules and pump laser diode modules

Fibre optic interconnecting devices and passive components - Performance standard - Part 081-02: Non-connectorized single-mode fibre optic middle-scale 1×N DWDM devices for category C - Controlled environments (IEC 61753-081-02:2023); German version EN IEC 61753-081-02:2023

Fibre optic interconnecting devices and passive components - Performance standard - Part 081-03: Non-connectorized single-mode fibre optic middle-scale 1×N DWDM devices for category OP - Outdoor protected environment (IEC 61753-081-03:2023); German version EN IEC 61753-081-03:2023