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CLC/TC 64/WG 03
To be set up - Earthing arrangements, protective conductors and protective bonding conductors
IEC 47/1907/NP
Proposal of the Korean NC: (Future IEC 62047-9): Semiconductor devices - Micro-electromechanical devices - Part 9: Bonding strength measurement in MEMS packaging
IEC 47D/107/FDIS
IEC 191-5: Mechanical standardization of semiconductor devices - Part 5: Recommendations applaying to integrated circuit packages using tape automated bonding (TAB)
IEC 55/1307/CDV
IEC 60317-35/Ed2: Specifications for particular types of winding wires - Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer
IEC 55/1308/CDV
IEC 60317-36/Ed2: Specifications for particular types of winding wires - Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer
IEC 55/1309/CDV
IEC 60317-37/Ed2: Specifications for particular types of winding wires - Part 37: Polyesterimide enamelled round copper wire, class 180, with a bonding layer
IEC 47F/106/NP
Future IEC 62047-15: Semiconductor devices Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
IEC 47F/126/CD
IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding quality between PDMS and glass
IEC 47F/149/CD
IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
IEC 55/1264/CD
IEC 60317-35 Ed. 2.0: Specifications for particular types of winding wires - Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer
