(Future IEC 61249-4-18): Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

IEC 61249-4-18: Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

IEC 61000-6-7: Electromagnetic compatibility (EMC) - Part 6-7: Generic standards - Immunity requirements for systems, equipment and products intended to perform functions in a safety-related system (functional safety) in industrial environments

IEC 60747-5-6 Ed. 1 : Semiconductor devices - Discrete devices - Part 5-6: Optoelectronic devices - Light emitting diodes

IEC 60191-2, F51, Ed.1: Plastic enhanced thin profile quad flatpack (HTQFP) outline family, heat slug up T-PQFP-G (If approved, to be published as Outline 152E-a-l)