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Committees

GAEB-AG 00

Principles

editorial staff

Jour fixe - GAEB@DIN

Testing group STLB-Bau

Further development of STLB-Bau

sustainability

IEC 60191-2: Proposal for a plastic thin shrink small outline package (TSSOP/HTSSOP), 1,00 mm lead length outline family, R-PDSO-G

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