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IEC 46C/556/NP
Communication cables - Part XX: Common design rules and construction - Halogen free flame retardant thermoplastic sheathing compounds
IEC 46C/557/NP
Communication cables - Part XX: Common design rules and construction - Filling compounds for filled cables
IEC 46C/558/NP
Communication cables - Part XX: Common design rules and construction - Cross-linked PE insulation compounds
IEC 46C/559/NP
Communication cables - Part XX: Common design rules and construction - Poly(tetrafluoroethylene-hexafluoropropylene) (FEP) insulation and sheathing
IEC 47/1973/NP
PNW 47-1973: Transmission line pulse measurement of human body model parameters for electrostatic discharge protection design of semiconductor devices
IEC 47D/229/NP
Proposal of the USNC: Common package unit design guide for BGA packages
IEC 47D/652/NP
Design guide for semiconductor packages - Ball Grid Array Package (BGA)
IEC 47D/653/NP
Design Guide for Stacked Packages and Individual Stackable packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA)
IEC 47D/677/NP
NP-PAS: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
IEC 47D/782/NP
(Future IEC 60191-6-22 Ed.1): Mechanical Standardization of Semiconductor Devices - Part 6-22: General rules for thepreparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
