(Future IEC 62047-17): Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

(Future IEC 62047-18): Semiconductor devices - Micro-electromechanical devices - Part 18: Micro electro mechanical devises - Bending test methods of thin film materials

(Future IEC 62047-19) Semiconductor devices -Micro-electromechanical devices - Part 19: Electronic compasses

Future IEC 62047-20: Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes

Future IEC 62047-21: Semiconductor devices - Micro-electromechanical devices Part 21: Test method for Poisson's ratio of thin film MEMS materials

Future IEC 62047-22: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

Future IEC 62047-23: Semiconductor devices - Micro-electromechanical devices - Part 23: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods

Future IEC 62047-15: Semiconductor devices Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass

Future IEC 62047-16: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods

Future IEC 60352-X: Solderless connections - Part X: Compression mount connections - General requirements, test methods and practical guidance