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IEC 47E/342/NP
Proposal of the Japanese NC: (Future IEC 60747-16-5): Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
IEC 47E/352/NP
Proposal of the German NC: (Future IEC 60747-x-y): Semiconductor devices - Magnetic and capacitive coupler for safe isolation
IEC 47E/413/NP
Future IEC 60747-17 Ed. 1.0: Semiconductor devices - Discrete devices - Part 17: Magnetic and capacitive coupler for basic and reinforced isolation
IEC 47E/424/NP
Future IEC 60747-14-6: Semiconductor devices - Part 14-6: Semiconductor sensors - Humidity sensor
IEC 47E/425/NP
Future IEC 60747-14-7: Semiconductor devices - Part 14-7: Semiconductor sensors - Flow meter
IEC 47E/426/NP
Future IEC 60747-14-8: Semiconductor devices - Part 14-8: Semiconductor sensors - Capacitive degradation sensor of liquid
IEC 47F/4/NP
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (Future IEC 62047-10)
IEC 47F/5/NP
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials (Future IEC 62047-11)
IEC 47F/38/NP
(Future IEC 62047-15): Semiconductor devices -Micro-electromechanical devices - Part 15: Test method for bond strength in PDMS/Glass chip
IEC 47F/39/NP
(Future IEC 62047-16): Semiconductor devices -Micro-electromechanical devices - Part 16: Test method forresidual stress measurement
