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DIN EN IEC 61557-18
Electrical safety in low voltage distribution systems up to 1 000 V AC and 1 500 V DC - Equipment for testing, measuring or monitoring of protective measures - Part 18: DC EV supply equipment monitoring device
DIN EN 3545-001 rev
Aerospace series - Connectors, electrical, rectangular, with sealed and non-sealed rear, plastic housing, locking device, operating temperatures - 55 °C to 175 °C - Part 001: Technical specification
prEN 3545-001 rev
Aerospace series - Connectors, electrical, rectangular, with sealed and non-sealed rear, plastic housing, locking device, operating temperatures - 55 °C to 175 °C - Part 001: Technical specification
prEN 3545-003 rev
Aerospace series - Connectors, electrical, rectangular, with sealed and non-sealed rear, plastic housing, locking device, operating temperatures - 55 °C to 175 °C - Part 003: Connectors with female contacts - Product standard
prEN 3545-004 rev
Aerospace series - Connectors, electrical, rectangular, with sealed and non-sealed rear, plastic housing, locking device, operating temperatures - 55 °C to 175 °C - Part 004: Connectors with male contacts - Product standard
DIN EN 3545-003 rev
Aerospace series - Connectors, electrical, rectangular, with sealed and non-sealed rear, plastic housing, locking device, operating temperatures - 55 °C to 175 °C - Part 003: Connectors with female contacts - Product standard
DIN EN 3545-004 rev
Aerospace series - Connectors, electrical, rectangular, with sealed and non-sealed rear, plastic housing, locking device, operating temperatures - 55 °C to 175 °C - Part 004: Connectors with male contacts - Product standard
FprEN ISO 13855
Safety of machinery - Positioning of safeguards with respect to the approach of the human body (ISO/FDIS 13855:2024)
IEC 47D/804/CDV
IEC 60191-6-1 Ed.2: Mechanical Standardization Of Semiconductor Devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for gull-wing lead terminals
IEC 47D/784/CDV
IEC 60191-6-12 Ed.2: Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA)
