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IEC 47/2064/NP
Future IEC 62435: Long-term storage of electronic semiconductor devices
IEC 47A/767/NP
Future IEC 62433-1: EMC IC modelling - Part 1: General modelling framework
IEC 47D/671/CD
NP-CD: (Future IEC 60191-6-14): General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
IEC 47D/782/NP
(Future IEC 60191-6-22 Ed.1): Mechanical Standardization of Semiconductor Devices - Part 6-22: General rules for thepreparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
IEC 47E/293/NP
(Future IEC 60747-14-5): Discrete semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
IEC 47E/297/NP
(Future IEC 60747-16-5): Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
IEC 47E/299/NP
(Future IEC 60747-14-6): Semiconductor devices - Discrete Devices - Part 14-6: Semiconductor sensors Test method of CMOS imagesensor module
IEC 47E/312/NP
(Future IEC 60747-16-5): Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
IEC 47E/328/NP
(Future IEC 60747-14-x): Semiconductor devices - Discrete devices - Part 14-x: Semiconductor sensors - Test method of CMOS image sensor module
IEC 47E/329/NP
(Future IEC 60747-14-7): Semiconductor devices - Discrete devices - Part 14-7: Semiconductor sensors - Humidity
