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IEC 33/343/CDV
Amendment 2 to IEC 60831-1 Ed. 2.0: 1996-11 - Changes in subclauses 7.2, 10.1 and 10.2 and in clause 15
IEC 38/392/NP
Future IEC 61869: Instrument Transformers on DC Current Transformers (Part 14) and DC Voltage Transformers (Part 15)
IEC 38/392A/NP
Comment received on Future IEC 61869: Instrument Transformers on DC Current Transformers (Part 14) and DC Voltage Transformers (Part 15)
IEC 47F/38/NP
(Future IEC 62047-15): Semiconductor devices -Micro-electromechanical devices - Part 15: Test method for bond strength in PDMS/Glass chip
IEC 47F/106/NP
Future IEC 62047-15: Semiconductor devices Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
IEC 47F/126/CD
IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding quality between PDMS and glass
IEC 47F/149/CD
IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
IEC 48B/729/NP
Proposal of the Secretary: Specification for small form factor 45.7 mm (1.8 in) disk drives, 15 mm (0.59 in) high
IEC 49/874/NP
Future IEC 61338-1-5: Waveguide type dielectric resonators, Part 1-5: General information and test conditions - Measurement method of conductivity at interface between conductor layer and dielectric substrate at microwave frequency
IEC 57/926/DC
Request by the IEEE PES PSCC Security Subcommittee for a category D liaison with WG 15 of IEC TC 57
