IEC 62047-22 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

IEC 62047-17 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

IEC 62047-21 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials

IEC 62047-22 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass

Comments received on 48D/339/NP: Dimensions and test method of general use 1U unit-case (Pizza-box) for electronic system, based on IEC 60297 series

EC 62610-2 TS Ed 1.0: Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 - Part 2: Design Guide: Method for determination of forced air-cooling structure

Piezoelectric and dielectric devices for frequency control and selection - Measurement of quartz crystal unit parameters - Method for the determination of equivalent electrical parameters for GHz band

Waveguide type dielectric resonators, General information and test conditions - Measurement method of conductivity at interface between conductor and dielectric material at microwave frequency

Guide of phase jitter measurement method for quartz crystal oscillators and SAW oscillators (IEC/PAS)