(Future IEC 61249-4-19): Materials for printed boards and other interconnecting structures - Part 4-19:Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance, non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Proposal for Amendment to IEC 61190-1-3 Ed. 2 (Lead-free solder alloys) - Additional information and extension of closing date from 2008-09-26 to 2008-10-03

Future IEC 61189-12: Test methods for electrical materials, interconnection structures and assemblies, Part-12 Erosion test method on the materials of solder bath or parts which contact with molten lead free solder.

Test method for erosion by molten lead free solder.

Test method for erosion of wave soldering equipments by molten lead free solder alloy-Part 1: Erosion test method for the metallic material without surface treatment

Lead-free electronics in aerospace

IEC/PAS 62647-1 Ed.1: Aerospace and military electronic systems containing lead-free solder - Part 1: Lead-free management

Aerospace and military electronic systems containing lead-free solder - Part 1: Lead-free management (IEC/PAS 62647-1)

IEC/PAS 62647-2 Ed.1: Aerospace and military electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin in high-reliability electronic systems

Aerospace and military electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin in high-reliability electronic systems (IEC/PAS 62647-2)