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ISO/IEC 9594-8 DAM 1
Information technology - Open systems interconnection - Part 8: The Directory: Public-key and attribute certificate frameworks - Amendment 1
ISO/IEC DIS 9594-12
Information technology - Open systems interconnection - Part 12: The Directory: Key management and public-key infrastructure establishment and maintenance
IEC 91/393/CD
IEC 61249-6-3, Ed.1: Materials for interconnection structures - Part 6-3: Sectional specification for reinforcements - Woven fibreglass fabrics
DIN IEC 61162-450
Maritime navigation and radiocommunication equipment and systems - Digital interfaces - Part 450: Multiple talkers and multiple listeners - Ethernet interconnection (IEC 80/1049/CD:2022); Text in German and English
DIN EN IEC 61189-3-302
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Computed tomography(CT) method for copper plating voids in metallized holes of PCB
DIN EN IEC 61010-2-203
Safety requirements for electrical equipment for measurement, control and laboratory use - Part 2-203: Particular requirements for industrial communication circuits and communication port interconnection (IEC 65/824/CD:2020); Text in German and English
DIN EN IEC 61189-2-805
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA (IEC 91/1696/CD:2020); Text in German and English
DIN EN IEC 61189-2-808
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English
DIN EN IEC 61189-2-809
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021); Text in German and English
DIN EN IEC 63215-5
Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices (IEC 91/1770/CD:2021); Text in German and English