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IEC 47D/647/CD
IEC 60191-2/f64, Ed 1: Proposed new package outline - Small outline package (SOT) 3-, 5- and 6-Lead SMD (to be published as 182E outline)
IEC 47D/671/CD
NP-CD: (Future IEC 60191-6-14): General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
IEC 47D/673/CD
NP-CD: IEC 60191-6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
IEC 47D/780/CDV
EC 60191-2 f65 Ed.1: Propsed New Package Outline-PlasticBottom-landed Small Outline Non-lead Package(P-BSO-N2/3/4/5/6)
IEC 48B/727/NP
Proposal of the Secretary: Specification for small form factor 45.7 mm (1.8 in) disk drives
IEC 48B/728/NP
Proposal of the Secretary: Specification for small form factor 33.0 mm (1.3 in) disk drives
IEC 48B/729/NP
Proposal of the Secretary: Specification for small form factor 45.7 mm (1.8 in) disk drives, 15 mm (0.59 in) high
IEC 48B/730/NP
Proposal of the Secretary: Specification for small form factor 63.5 mm (2.5 in) disk drives
IEC 48D/462/CDV
IEC 60297-3-107 Ed 1.0: Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-107: Dimensions of subracks and plug-in units, small form factor
IEC 62D/670/NP
New Work Item Proposal on ISO 80369-2 ed1: Small-bore connectors for liquids and gases in healthcare applications - Part 2: Connectors for breathing systems and driving gases
